| Antibacterial activity of AgNPs–TiO 2 nanotubes: influence of different nanoparticle stabilizers O Bilek, T Fialova, A Otahal, V Adam, K Smerkova, Z Fohlerova RSC advances 10 (72), 44601-44610, 2020 | 15 | 2020 |
| Influence of heat flow direction on solder ball interfacial layer A Otáhal, I Szendiuch Journal of Electrical Engineering 69 (4), 305-310, 2018 | 11 | 2018 |
| Rapid characterization of biomolecules’ thermal stability in a segmented flow-through optofluidic microsystem Z Fohlerova, H Zhu, J Hubalek, S Ni, L Yobas, P Podesva, A Otahal, ... Scientific Reports 10 (1), 6925, 2020 | 7 | 2020 |
| Importance of vibration testing for new technological solutions I Szendiuch, B Psota, A Otahal, M Klapka EMPC2013, Grenoble, 10-12, 2013 | 6 | 2013 |
| Influence of heating direction on BGA solder balls structure A Otáhal, J Somer, I Szendiuch 2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017 | 5 | 2017 |
| SiO2‐Decorated Parylene C Micropillars Designed to Probe Cellular Force Z Fohlerova, I Gablech, A Otahal, P Fecko Advanced Materials Interfaces 8 (6), 2001897, 2021 | 4 | 2021 |
| Mechanical testing of PCB using computer simulations B Psota, A Otáhal, I Szendiuch Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 4 | 2014 |
| Impact of solder paste drying on the solderability A Otahal, M Adamek, I Szendiuch Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 4 | 2014 |
| Influence of electric current at solidification of solder J Skácel, A Otáhal, I Szendiuch 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019 | 3 | 2019 |
| X-ray inspection of ceramic structures J Skácel, A Otáhal, I Szendiuch, E Hejátková 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-4, 2018 | 3 | 2018 |
| Investigation of the mechanical properties of lead-free solder materials A Otáhal, M Adamek, V Jansa, I Szendiuch Key Engineering Materials 592, 453-456, 2014 | 3 | 2014 |
| A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components P Lukacs, T Rovensky, A Otahal Journal of Electronic Packaging 146 (1), 011004, 2024 | 2 | 2024 |
| Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications L Chmelikova, P Fecko, J Chmelik, J Skacel, A Otahal, Z Fohlerova Applied Materials Today 31, 101736, 2023 | 2 | 2023 |
| Current Load of Thick-film Pastes for Power Applications J Skácel, A Otáhal, J Jankovský, I Szendiuch 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020 | 2 | 2020 |
| Innovative methods in activation process of through-hole plating A Otáhal, V Šimek, A Crha, R Růžička, I Szendiuch Periodica Polytechnica Electrical Engineering and Computer Science 60 (4 …, 2016 | 2 | 2016 |
| Influence of the PCB attachment on the mechanical properties in modal analysis B Psota, A Otáhal, I Szendiuch 2015 European Microelectronics Packaging Conference (EMPC), 1-4, 2015 | 2 | 2015 |
| Influence of the cavities on the PCB mechanical properties B Psota, A Otáhal, I Szendiuch Circuit World 41 (2), 76-79, 2015 | 2 | 2015 |
| Vibration Testing as a Tool to Optimize the Configuration of the PCBs I Szendiuch, B Psota, A Otáhal, M Klapka International Symposium on Microelectronics 2014 (1), 000050-000054, 2014 | 2 | 2014 |
| Importance of vibration testing for new technological configurations in electronics I Szendiuch, B Psota, A Otahal, M Klapka 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-5, 2013 | 2 | 2013 |
| Study of atmosphere influence on bga solder balls process A Otáhal, I Szendiuch Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | 2 | 2013 |
