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Co-authors
- Joshua SiegelMichigan State UniversityVerified email at msu.edu
- Ajay DeshpandeGoogle, Past - IBM Research, MITVerified email at alum.mit.edu
- Jason S. KuLecturer, Massachusetts Institute of TechnologyVerified email at mit.edu
- Sameer KhandekarSir M. Visvesvaraya Chair Professor and Head (ME), Indian Institute of Technology Kanpur, KanpurVerified email at iitk.ac.in
- K. MuralidharProfessor of Mechanical Engineering, Indian Institute of Technology Kanpur IndiaVerified email at iitk.ac.in
- Dr. Basant Singh SikarwarAmity University Uttar Pradesh NOIDA, IndiaVerified email at amity.edu
- Smita AgrawalSenior Engineer. The Dow Chemical CompanyVerified email at umn.edu
- Rahul BhattacharyyaDirector, MIT Auto-ID LabsVerified email at mit.edu
- Edmund W. SchusterMITVerified email at mit.edu
- Sundar AtreUniversity of Louisville - Endowed Chair of Manufacturing & MaterialsVerified email at scipivision.com
- Erik WilhelmKyburz SwitzerlandVerified email at kyburz-switzerland.ch
- Emran Md AminR&D Engineer, Radio Frequency SystemsVerified email at acma.gov.au
- Vivek K GoyalBoston UniversityVerified email at bu.edu
- Dimitris ChatzigeorgiouRobotics Software EngineerVerified email at mit.edu
- Atia E. KhalifaKing Fahd University of Petroleum & MineralsVerified email at kfupm.edu.sa
- Rached Ben MansourKFUPMVerified email at kfupm.edu.sa