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Fan RenUniversity of Florida, Bell Lab, AT&TVerified email at che.ufl.edu
Changzhi LiTexas Tech UniversityVerified email at ttu.edu
Stephen PeartonProfessor of Materials Science and Engineering, University of FloridaVerified email at mse.ufl.edu
Zhen Ning LowQualcommVerified email at qualcomm.com
Tatsuo ItohProfessor of Electrical Engineering, UCLAVerified email at ee.ucla.edu
Li-Chia Tien (田禮嘉)Professor, National Dong Hwa UniversityVerified email at mail.ndhu.edu.tw
Brent P. GilaUniversity of FloridaVerified email at ufl.edu
Travis J. AndersonUniversity of FloridaVerified email at che.ufl.edu
Yu-Te LiaoNational Yang Ming Chiao Tung UniversityVerified email at g2.nctu.edu.tw
Byung-Hwan ChuIBM, Samsung, U or FloridaVerified email at ufl.edu
Tzyy-Sheng HorngProf. of Electrical Engineering, National Sun Yat-Sen University, TaiwanVerified email at ee.nsysu.edu.tw
Tien-Yu HuangQualcommVerified email at qti.qualcomm.com
Yves BaeyensNokia Bell-LabsVerified email at columbia.edu
Lars VossLawrence Livermore National LaboratoryVerified email at llnl.gov
Jiancheng Yang. PhDKeysight TechnologiesVerified email at keysight.com
Yu-Lin WangNational Tsing Hua University, Institute of Nanoengineering and MicrosystemsVerified email at mx.nthu.edu.tw
Jianxuan TuVerified email at ufl.edu
Ryan TsengShield AIVerified email at shield.ai
Fu-Kang Wang國立中山大學電機工程學系Verified email at student.nsysu.edu.tw
Wayne JohnsonSoundside Partners LLCVerified email at soundsidepartners.com