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Márta Rencz
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Year
CMOS sensors for on-line thermal monitoring of VLSI circuits
V Szekely, C Marta, Z Kohari, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 270-276, 1997
1591997
Measuring partial thermal resistances in a heat-flow path
MR Rencz, V Székely
IEEE Transactions on Components and Packaging Technologies 25 (4), 547-553, 2002
1392002
Thermal dynamics and the time constant domain
V Székely, M Rencz
IEEE transactions on components and packaging technologies 23 (3), 587-594, 2000
1222000
Electro-thermal and logi-thermal simulation of VLSI designs
V Szekely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997
1161997
Thermal measurement and modeling of multi-die packages
A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ...
IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009
972009
Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities
M Rencz, V Székely, A Morelli, C Villa
Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2002
952002
Structure function evaluation of stacked dies
M Rencz, V Szekely
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
892004
Dynamic thermal multiport modeling of IC packages
M Rencz, V Székely
IEEE Transactions on Components and Packaging Technologies 24 (4), 596-604, 2001
872001
Challenges in thermal interface material testing
CJM Lasance, CT Murray, DL Saums, M Rencz
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management …, 2006
852006
Multi-domain simulation and measurement of power LED-s and power LED assemblies
A Poppe, G Farkas, V Székely, G Horváth, M Rencz
Twenty-second annual IEEE semiconductor thermal measurement and management …, 2006
822006
Studies on the nonlinearity effects in dynamic compact model generation of packages
M Rencz, V Székely
IEEE Transactions on Components and Packaging Technologies 27 (1), 124-130, 2004
772004
Increasing the accuracy of structure function based thermal material parameter measurements
M Rencz, A Poppe, E Kollár, S Ress, V Székely
IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005
712005
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
Microelectronics Reliability 40 (3), 517-524, 2000
662000
Thermal mapping with liquid crystal method
A Csendes, V Szekely, M Rencz
Microelectronic Engineering 31 (1-4), 281-290, 1996
631996
An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL
A Csendes, V Szekely, M Rencz
Microelectronics Journal 29 (4-5), 241-255, 1998
581998
Recent progress of thermal interface material research-an overview
J Liu, B Michel, M Rencz, C Tantolin, C Sarno, R Miessner, KV Schuett, ...
2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008
562008
New possibilities in the thermal evaluation, offered by transient testing
M Rencz
Microelectronics Journal 34 (3), 171-177, 2003
532003
Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires
A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz
Energies 12 (10), 1909, 2019
492019
Tracing the thermal behavior of ICs
V Székely, M Rencz, B Courtois
IEEE Design & Test of Computers 15 (2), 14-21, 1998
491998
CMOS temperature sensors and built-in test circuitry for thermal testing of ICs
V Székely, M Rencz, S Török, C Marta, L Lipták-Fegó
Sensors and Actuators A: Physical 71 (1-2), 10-18, 1998
451998
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Articles 1–20